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PPGA
Last modified: Wednesday, January 15, 2003 

Short for Plastic Pin Grid Array. PPGAs were first developed by Intel in 1993 to combat power supply decoupling issues in high-performance microprocessors.This square chip packaging technology was designed for microprocessors with greater numbers of transistors on each chip than previous models. Unlike ceramic pin grid arrays (CPGA) or tape carrier packages (TCP), PPGA packages offer a greater amount of thermal resistance and improved electrical performance and power distribution, which directly affect the potential performance of microprocessors sensitive to heat transmission.

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For internet.com pages about PPGA . Also check out the following links!

Related Links

Hardware Central 
Detailed test reports on the latest desktop and laptop computers. Plus news on trend-setting products just coming into the pipeline.

Intel Packaging Databook 
Data reference guide to Intel package selection and availability.

An Introduction to Plastic Pin Grid Array Packaging
Includes and overview, performance and system level characteristics and a performance comparison with CPGA.

PowerLeap PL-Neo S370 Review
FC-PGA and PPGA differences are examined and why the two are not interchangeable.

PPGA Manufacturing Advantage Tips
Practical tips that make it easier for you to use Intel products in the manufacturing environment.

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Hardware

Microprocessors

related terms

FC-PGA

Intel

PGA


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