Short for
Thin Small Outline Package, it's a surface-mount memory
packaging from
Intel. Features of the TSOP include the following:
JEDEC and EIAJ standard
dimensions, it's the smallest leaded package form factor for flash, 0.5 mm (19.7 mil)
lead pitch, reduced total package height, 1.20 mm maximum, gull wing formed
leads, and supports future flash density and feature growth. Intel's TSOP
package is offered in 32-lead, 40-lead, 48-lead and 56-lead versions in JEDEC
and EIAJ registered standard dimensions.
See also Small Outline Package.